ParICs 介紹

zbow

發現這版還真的很冷清,

剛看了一下官網, 把產品介紹貼上, 希望大家多多收集資料. :)

                               
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Automated IC package geometry creation   
Compatible with: HFSS, Q3D Extractor, Maxwell 3D

                               
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Ansoft designed the ParICs Physical IC Modeler specifically to meet theneeds of package engineering. With this automated modeling tool,engineers can generate models of leaded IC packages in minutes and usethem for design, electrical characterization, and productdocumentation.
ParICs features:

• Spreadsheet-like prompts for JEDEC-like package parameters;
• Design Rule Checking for adherence to JEDEC-like and industry standards and manufacturability;
• Quick model generation for AutoCAD® and Ansoft 3D EM-based products
• Support on PCs and UNIX® workstations