ParICs 介紹
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Automated IC package geometry creation
Compatible with: HFSS, Q3D Extractor, Maxwell 3D
http://www.ansoft.com/images/parics.gif
Ansoft designed the ParICs Physical IC Modeler specifically to meet theneeds of package engineering. With this automated modeling tool,engineers can generate models of leaded IC packages in minutes and usethem for design, electrical characterization, and productdocumentation.
ParICs features:
[*]Spreadsheet-like prompts for JEDEC-like package parameters;[*]Design Rule Checking for adherence to JEDEC-like and industry standards and manufacturability;[*]Quick model generation for AutoCAD® and Ansoft 3D EM-based products[*]Support on PCs and UNIX® workstations
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